Nowadays, modern electronic systems like mobile phones are integrating an increasing number of sophisticated and heterogeneous functions, such as GPS, video cameras and MP3 players. The key features of this revolution are the increase of system complexity, the development of new dense 3D packaging structures and the increase of signaling rates. The complexity, the large integration and the fast signals require the accurate prediction of the whole system performance in the early phase of the design. The aim of the MOCHA project is the development of a set of integrated EDA tools and modeling flows that combine the availability of accurate models for the new devices like advanced IC interfaces and RF components, either extracted by simulation or measurement, with a reliable system-level simulation for System-in-Package (SiP) design and verification.

Work Packages
The MOCHA project work plan is organized into four major work packages, WP1, WP2, WP3,
WP4, which logically define the different fields that have to be addressed in order to achieve the
expected technical goals. The WP sequence has been defined in such a way that the different
activities - parametric macro models generation, 3D EM engine development, SI simulation and
measurements strategies identification - are initially developed separately but interacting each other
where needed, and are later merged together for the implementation of reliable simulation and
measurement design verification platforms.